Baum, M.M.BaumLetsch, H.H.LetschShaporin, A.V.A.V.ShaporinOtto, T.T.OttoGessner, T.T.Gessner2022-03-102022-03-102007https://publica.fraunhofer.de/handle/publica/357390enDevelopment and characterization of Cu to Cu bonding technologyconference paper