Eldring, J.J.EldringZakel, E.E.Zakel2022-03-082022-03-081997https://publica.fraunhofer.de/handle/publica/303791In a chip bonding process, the first bonding bumps are applied to the contact electrodes of a chip, a flexible circuit carrier is arranged on the chip, whereby the circuit carrier has openings which are aligned with the bonding bumps, whereby the second contact bumps are applied to the first contact bumps in such as way that bonding pads on the first circuit carriers are in contact with the first and/or second contact bumps.de608621patent1994-4446471