Baum, MarioMarioBaumBesser, J.J.BesserJohn, B.B.JohnKeiper, B.B.KeiperHänel, J.J.HänelWiemer, MaikMaikWiemerGeßner, ThomasThomasGeßner2022-03-122022-03-122012https://publica.fraunhofer.de/handle/publica/376950This paper will show the realization of micro structures in polymeric materials including the preparation of high precision embossing masters. For embossing a two-depth silicon master tool was developed, that is known as 2.5 dimensional pattern. Goal of the investigation and reason for the second depth was the implementation of a special welding structure and the realization of smallest possible join formation between polymer substrates. After the Si master tool was realized the micro structures were molded to a so called soft working stamp. Using this stamp the patterns were transferred to a polymeric substrate under accompanying characterization and measurement. At least the channel like structures should be covered by another polymer. Therefore a laser transmission welding process was developed. With an additional absorbing layer two transparent substrates were welded by an infrared laser. Finally the strength of the bonding interface was character-ized by a micro chevron pull test.enconference paper