Michel, B.B.Michel2022-03-092022-03-091995https://publica.fraunhofer.de/handle/publica/324194In microelectronics the problem of interconnected materials of different kind (metals, ceramics, polymeric materials) is of growing importance. Mechanical and thermal misfit problems have a dominant influence upon the reliability of electronic components and systems as well. The author deals with applications of so-called "Fracture Electronics". Several examples of electronic packaging technologies are discussed (chip cards technologies, flip chip, chip-on-board) under the special aspects of material mechanics problems.deelectronic packagingfracture electronicsmaterial mechanicsmechanical reliabilitymicromechanicsmicrosystem technology621conference paper