2023-06-122023-06-122023979-8-3503-4598-8979-8-3503-4597-1https://publica.fraunhofer.de/handle/publica/44268510.1109/EuroSimE56861.2023en24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023