Wolf, M.J.M.J.WolfEngelmann, G.G.EngelmannDietrich, L.L.DietrichReichl, H.H.Reichl2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/35254510.1016/j.nima.2006.05.046Flip chip technology is a key driver for new complex system architectures and high-density packaging, e.g. sensor or pixel devices. Bumped wafers/dice as key elements become very important in terms of general availability at low cost, high yield and quality level. Today, different materials, e.g. Au, Ni, AuSn, SnAg, SnAgCu, SnCu, etc., are used for flip chip interconnects and different bumping approaches are available. Electroplating is the technology of choice for high-yield wafer bumping for small bump sizes and pitches. Lead-free solder bumps require an increase in knowledge in the field of under bump metallization (UBM) and the interaction of bump and substrate metallization, the formation and growth of intermetallic compounds (IMCs) during liquid- and solid-phase reactions. Results of a new bi-layer UBM of Ni-Cu which is especially designed for small-sized lead-free solder bumps will be discussed.enflip chip technologyhigh-density packaginghigh-yield wafer bumpingelectroplatinglead-free solder bump621conference paper