Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems

Streiter, R.R.StreiterWolf, H.H.WolfZhu, Z.Z.ZhuXiao, X.X.XiaoGessner, T.T.Gessner2022-03-032022-03-032002https://publica.fraunhofer.de/handle/publica/20250310.1016/S0167-9317(01)00579-22-s2.0-0036132763en621Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systemsjournal article