Kärnfelt, C.C.KärnfeltHallin, J.J.HallinKjellberg, T.T.KjellbergHansson, B.B.HanssonSwahn, T.T.Swahn2022-03-102022-03-102007https://publica.fraunhofer.de/handle/publica/35761810.1109/EMICC.2007.4412714Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of -3.5 V and consumes 2.1 W.en003006519conference paper