Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems

Bonitz, JensJensBonitzBöttger, SimonSimonBöttgerHerrmann, S.S.HerrmannSchulz, Stefan E.Stefan E.SchulzGeßner, ThomasThomasGeßnerHartmann, SusanneSusanneHartmannWunderle, BernhardBernhardWunderle2022-03-132022-03-132016https://publica.fraunhofer.de/handle/publica/39549710.1109/NEMS.2016.7758322In this paper we present a holistic wafer-level manufacturing process for nanoscopic sensor devices based on individualized single-wall carbon nanotubes (SWCNTs) integrated in MEMS. The fabrication technology is demonstrated in detail. Moreover, a first application in form of a MEMS test stage for SWCNT strain and reliability experiments is shown.enWafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systemsconference paper