Wiesenfarth, MaikeMaikeWiesenfarthThaller, S.S.ThallerJaus, JoachimJoachimJausEltermann, FabianFabianEltermannPassig, M.M.PassigBett, Andreas W.Andreas W.Bett2022-03-118.8.20142010https://publica.fraunhofer.de/handle/publica/36890510.24406/publica-r-36890510.4229/25thEUPVSEC2010-1BO.6.6Long lifetime of concentrator photovoltaic systems strongly depends on the reliability of the interconnection technologies. In this paper the result of experiments to investigate the long term stability of a lead free Sn95.5Ag4Cu0.5 solder alloy and two isotropic conductive adhesives are presented. Samples were subjected to accelerated aging consisting of high temperature storage at 150 °C and temperature cycles between -30 and 125 °C. The samples were characterised after various aging steps by x-ray imaging, scanning electron microscope and energy dispersive x-ray. The experiments showed a degradation of the soldered samples through the formation of cracks in the joint. Also a growth of brittle intermetallic phases was determined which can promote the generation of cracks. One of the tested adhesives shows a positive post curing and no degradation after aging. The second adhesive shows some cracks after the hard tests.enMaterialien - Solarzellen und TechnologieIII-V und Konzentrator-PhotovoltaikAlternative Photovoltaik-TechnologienKonzentrator-BauelementeHochkonzentrierende Systeme (HCPV)KonzentratormoduleKonzentrator-ProduktionsprozessKonzentrator-Zuverlässigkeitsuntersuchung621697Investigations on interconnection technologies for CPV systemsconference paper