Under CopyrightSchletz, AndreasAndreasSchletzBayer, ChristophChristophBayerHutzler, AaronAaronHutzler2022-03-142.4.20192019https://publica.fraunhofer.de/handle/publica/40422210.24406/publica-fhg-404222entemperature challenges670620530Temperature Challenges for Integrated Systems due to High Power Densitypresentation