Under CopyrightHeinig, AndyAndyHeinigHopsch, FabianFabianHopsch2022-03-144.11.20202020https://publica.fraunhofer.de/handle/publica/40910910.24406/publica-fhg-409109This talk is presenting a reference flow for a chip-package co-design. The technology used, is a 22FDx IC-technology combined with a two-level package technology. The application case is data transfer at 60GHz for 5G. To cope with the requirements of such a system an Assembly Design Kit (ADK) is necessary to enable co-design.en621004presentation