Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers

Wächtler, T.T.WächtlerOswald, S.S.OswaldPohlers, A.A.PohlersSchulze, S.S.SchulzeSchulz, S.E.S.E.SchulzGessner, T.T.Gessner2022-03-102022-03-102008https://publica.fraunhofer.de/handle/publica/361292enCopper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriersconference paper