Blaho, M.M.BlahoPogany, D.D.PoganyGornik, E.E.GornikZullino, L.L.ZullinoMorena, E.E.MorenaStella, R.R.StellaAndreini, A.A.Andreini2022-03-092022-03-092003https://publica.fraunhofer.de/handle/publica/34216410.1109/RELPHY.2003.11977512-s2.0-0037634551BCD electrostatic discharge (ESD) protection npn devices with and without a sinker are analyzed experimentally and by device simulation. The device internal thermal and free carrier density distributions during vf-TLP and TLP stresses are studied by a backside transient interferometric mapping technique. Experimentally observed activity of lateral and vertical parts of the npn transistor are well reproduced by the simulation.en621Internal behavior of BCD ESD protection devices under very-fast TLP stressconference paper