Klocke, FritzFritzKlockeHuttenhuis, S.S.HuttenhuisPähler, DietmarDietmarPählerVojtechovsky, K.K.Vojtechovsky2022-03-092022-03-092003https://publica.fraunhofer.de/handle/publica/343725The Multi-Wire Slicing (MWS) technique is successfully introduced in the mass production of plane workpieces such as wafers due to its high productivity. With increasing demands on the wafer's quality, especially with regard to the rising wafer diameters, the existing MWS-technique has to be improved. One promising new approach, the »Both Direction« (BD) machining principle, is proposed.enwafer siliconlappingWire670658conference paper