Schreier-Alt, T.T.Schreier-AltBraun, T.T.BraunBecker, K.-F.K.-F.BeckerRebholz, C.C.RebholzWunderle, B.B.WunderleReichl, H.H.Reichl2022-03-042022-03-042009https://publica.fraunhofer.de/handle/publica/219384Flip chip encapsulation with simultaneous underfilling and overmolding has proven to be a highly reliable encapsulation technique on high Tg FR-4 substrates. The combination with MAP-type overmolding enables cost attractive production of various multi chip module layouts. Together with integrated optical functions and embedded components, the printed circuit board technology will stay an innovative, attractive and nevertheless cost efficient electronic platform.enflip-chiptransfer molding621journal article