Pavlicek, N.N.PavlicekLiu, C.C.LiuLoisy, J.-Y.J.-Y.LoisySalvatore, G.G.SalvatoreMohn, F.F.MohnSchuderer, J.J.SchudererApelsmeier, A.A.ApelsmeierDresel, F.F.DreselSchletz, A.A.SchletzVater, S.S.Vater2022-03-142022-03-142019https://publica.fraunhofer.de/handle/publica/40649810.23919/EPE.2019.8915223This paper presents the design and reliability assessments of a novel power semiconductor module platform for the automotive powertrain. Solder-free interconnects enable superior reliability meeting future automotive requirements. Modules with heavy Cu wire bonding on sintered top plates show a strongly improved power cycling lifetime compared to standard Al wire bonding. However, new failure modes are observed for the fully sintered devices.en670620530conference paper