Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Rudzki, J.J.RudzkiOsterwald, F.F.OsterwaldBecker, M.M.BeckerEisele, R.R.EiselePoech, M.H.M.H.Poech2022-03-132022-03-132014https://publica.fraunhofer.de/handle/publica/3988562-s2.0-85073238205en621Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layersconference paper