Thermo-mechanical reliability analysis on solder joints of ceramic components

Dudek, R.R.DudekDöring, R.R.DöringMichel, B.B.MichelPicault, A.A.PicaultAutissier, J.-F.J.-F.Autissier2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/349193en621Thermo-mechanical reliability analysis on solder joints of ceramic componentsconference paper