Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test

Petzold, M.M.PetzoldKnoll, H.H.KnollBagdahn, J.J.Bagdahn2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/33861610.1117/12.442994en531620Strength assessment of wafer-bonded micromechanical components using the micro-chevron-testconference paper