Ramm, PeterPeterRammFranzon, PaulPaulFranzonGarrou, PhilipPhilipGarrouSwaminathan, RajaRajaSwaminathanVivet, PascalPascalVivetBadaroglu, MustafaMustafaBadaroglu2022-03-062022-03-062021https://publica.fraunhofer.de/handle/publica/265466enheterogeneous integration3DIC3D integrationchiplet3D stackingsensor integrationinterposer621Heterogeneous integration and chiplet assembly - all between 2D and 3Djournal article