Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications

Haberland, J.J.HaberlandPahl, B.B.PahlKallmayer, C.C.KallmayerAschenbrenner, R.R.AschenbrennerReichl, H.H.Reichl2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/3537292-s2.0-84876580017en621Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applicationsconference paper