Riedel, S.S.RiedelSchulz, S.E.S.E.SchulzBaumann, J.J.BaumannRennau, M.M.RennauGessner, T.T.Gessner2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/33739910.1016/S0167-9317(00)00450-0en621Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusionconference paper