Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs

Mießner, R.R.MießnerAschenbrenner, R.R.AschenbrennerReichl, H.H.ReichlLing, S.S.LingLe, B.B.LeLew, A.A.LewBenson, R.R.BensonNhan, E.E.Nhan2022-03-092022-03-092000https://publica.fraunhofer.de/handle/publica/33593710.1109/ECTC.2000.853314en621Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costsconference paper