Bräuer, A.A.BräuerBrückner, A.A.BrücknerWippermann, F.F.WippermannOberdörster, A.A.Oberdörster2022-03-132022-03-132015https://publica.fraunhofer.de/handle/publica/39448810.1109/MOC.2015.74163842-s2.0-84969560114The slim design of portable electronic devices (e.g. smartphones) causes a constant need for miniaturized camera systems. This trend pushes the shrinking of opto-electronic, electronic and optical components. While opto- and micro-electronics have made tremendous progress, the technology for the miniaturization of optics still struggles to keep up. The demand for a higher image resolution and large aperture of the lens (both driven by shrinking pixel size) conflict with the need for a short focal length and a simple, compact design. These conditions impose high demands on the fabrication technology, especially when considering that it has to meet one-hundreds of a percent relative accuracy. Wafer-level optics (WLO) fabrication for camera lenses is a promising candidate, enabling high-volume production with low cost. However, the resolution that is currently available with WLO-technology is limited due to material and process control issues.enconference paper