Under CopyrightSchindler-Saefkow, F.F.Schindler-SaefkowSchramm, H.H.SchrammAmiri Jam, K.K.Amiri JamGaßmann, S.S.Gaßmann2022-03-1010.03.20072005https://publica.fraunhofer.de/handle/publica/34984610.24406/publica-fhg-349846The 3D-packaging technology makes it possible to stack the PCBs on top of each other and thus to make full use of the third dimension. A patent for the new technology concept has been realized. The paper presents a fluidicly cooled 11-PCB-layer with high power components (48 W). Water channels in the PCB-package dissipate the heat from the inside of the package to the environment. Active parts can be integrated with the solder ring technology. The paper shows the setup and the technology for an ultra-thin PCB micro pump. The stacking of the PCB-pump-layers was done for the first time with the solder ring technology.en621presentation