Lempfer, K.K.Lempfer2022-03-022022-03-021985https://publica.fraunhofer.de/handle/publica/172996enAnwendungGipsspanplatteHalbtrockenverfahrenVerfahrensbeschreibungWerkstoffeigenschaft674Semi-dry method for the manufacture of gypsum-bonded particleboards and their properties in comparison with other inorganically bonded wood-based panelsbook article