14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

2022-03-022022-03-022013978-1-4673-6138-5978-1-4673-6139-2https://publica.fraunhofer.de/handle/publica/15526114th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013