Schubert, T.T.SchubertCiupinski, L.L.CiupinskiZielinski, W.W.ZielinskiMichalski, A.A.MichalskiWeißgärber, T.T.WeißgärberKieback, B.B.Kieback2022-03-042022-03-042008https://publica.fraunhofer.de/handle/publica/21527710.1016/j.scriptamat.2007.10.0112-s2.0-36348978569Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer. Entnommen aus <a_href="http://www.fiz-technik.de/db/b_tema.htm" target="_blank">TEMA</a>enKupferKühlkörperDiamantDispersionsgefügeGrenzschicht-fest-festPulvermetallurgieThermischer AusdehnungskoeffizientGrenzflächenreaktionKupferchromlegierung620660671669journal article