Krems, T.T.KremsTessmann, AxelAxelTessmannHaydl, W.H.W.H.HaydlSchmelz, C.C.SchmelzHeide, P.P.Heide2022-03-092022-03-091998https://publica.fraunhofer.de/handle/publica/33013610.1109/MWSYM.1998.705183The impact of the packaging configuration on cross talk and feed back effects caused by parasitic substrate modes is investigated for coplanar millimeter-wave circuits. It is demonstrated theoretically and by means of several circuit examples that both the mounting configuration and the thickness of the semiconductor substrate of coplanar MMICs have to be chosen appropriately, in order to avoid circuit degradation or even failure.encoplanarEinbautechnikkoplanarMMICpackagingparasitäre Modenparasitic modes621667conference paper