2022-03-092022-03-091995https://publica.fraunhofer.de/handle/publica/325254encouplingdeformation measurement techniqueelectronic packagingFEMmechanical analysismesh refinementnonlinear material representationthermal analysisthermal stressthermal test cycle621Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysisconference proceeding