Jerchel, K.K.JerchelGrams, A.A.GramsNissen, N.F.N.F.NissenSuga, T.T.SugaLang, K.-D.K.-D.Lang2022-03-132022-03-132017https://publica.fraunhofer.de/handle/publica/39749010.23919/ICEP.2017.79393762-s2.0-85021440891A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.en621conference paper