Under Copyright2022-03-0711.1.20082006https://publica.fraunhofer.de/handle/publica/29321510.24406/publica-fhg-293215Microsystems Technology S.5 IC-Technology S.5 Biotechnical Microsystems S.5 Module Integration S.5 Integrated Power Systems S.5-11 MANAGEMENT S.12 TASKS S.12-41 Abstract S.42 Introduction S.42 Experimental S.43 Temperature stress S.43 Results and Discussion The Ti/TiN stack S.44-45 The TiN layer S.46 Conclusion S.47-59 Mediating environmental S.60 awareness into electronics production S.60 Lead-free soldering S.60 means narrower process window S.60 External assistance in conversion to RoHS compliant products S.60 The Life Environment LEADFREE project S.61 Technology provided S.62 Practice and Training Concept S.62-63 Case Examples S.64 Key examples are three consecutive projects on wave soldering S.65 The effect of nickel content on copper leaching S.65 Survey of the demand for centralized practice and training equipment S.65 Introduction S.66 Description of the Preperation System S.67 Preparation Method S.67 Evaluation of the Equipment S.68 Dissolution S.69 Whisker growth S.69 Conclusions S.69-70 Handling concept for S.71 arbitrary flex substrates S.71 Implantable hearing aids S.72-74 External hearing aids ("EXT") S.75en621annual report