Eichler, M.M.EichlerNagel, K.K.NagelReim, L.C.L.C.ReimKlages, C.-P.C.-P.Klages2022-03-132022-03-132015https://publica.fraunhofer.de/handle/publica/390622Patterned atmospheric pressure plasma treatments were used to control free surface energy on silicon wafers before bonding. Surface energy measurements in situ during annealing are presented for SF6 etching as well as C4F8 and acetylene coatings. The bonding energy can be permanently reduced by appropriate coatings or surface roughness.enconference paper