Wittler, O.O.WittlerMroßko, R.R.MroßkoKaulfersch, E.E.KaulferschWunderle, B.B.WunderleMichel, B.B.Michel2022-03-102022-03-102008https://publica.fraunhofer.de/handle/publica/36097410.1109/ESTC.2008.4684488Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of microelectronic products. Therefore a method for obtaining elastic-plastic material data is analyzed and discussed in this paper. It is based on the nanoindentation of a film on a silicon substrate and the modeling of it. Thus it becomes possible to fit specific material models to the indentation experiment. Results are shown for two AlSiCu layers.enconference paper