Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS

Dietrich, L.L.DietrichToepper, M.M.ToepperEhrmann, O.O.EhrmannReichl, H.H.Reichl2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/35321810.1109/ECTC.2006.1645783en621Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMSconference paper