Frickinger, J.J.FrickingerOechsner, R.R.OechsnerSchellenberger, M.M.SchellenbergerPfeffer, M.M.PfefferPfitzner, L.L.PfitznerRyssel, H.H.RysselClaeys, C.C.ClaeysClaes, M.M.ClaesBearda, T.T.BeardaRenaud, D.D.RenaudDanel, A.A.DanelLering, M.M.LeringGraef, M.M.GraefKaushik, V.V.KaushikMurphy, B.B.MurphyFritzsche, M.M.FritzscheWalther, H.H.WaltherHury, S.S.Hury2022-03-102022-03-102006https://publica.fraunhofer.de/handle/publica/354140FLYING WAFER was a joint European project funded in the 6th Framework of the European Commission. The objective was to provide a methodology for interlinking European R&D centres in micro- and nanotechnologies to a distributed 300 mm CMOS R&D line. The FLYING WAFER project was carried out as a feasibility study. Therefore, the results provided a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multi-site processing.en670conference paper