Temperature Challenges for Integrated Systems due to High Power Density

CC BY-ND 4.0Schletz, AndreasAndreasSchletzBayer, ChristophChristophBayerHutzler, AaronAaronHutzler2022-12-222022-12-222022-09-27https://publica.fraunhofer.de/handle/publica/430403https://doi.org/10.24406/publica-68110.24406/publica-681enTemperature Challenges for Integrated Systems due to High Power Densitypresentation