Bär, E.E.BärBenvenuti, A.A.BenvenutiHenke, W.W.HenkeJünemann, B.B.JünemannKalus, C.C.KalusNiedermaier, P.P.NiedermaierLorenz, J.J.Lorenz2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/328460A software package for the three-dimensional simulation of topography processes which has been developed within the European project PROMPT is described. The software is capable of simulating lithography, dry-etching and layer deposition processes. The individual modules have been integrated into a unified environment, thus allowing simulation of complete topography process sequences. As an example, a complete simulation consisting of lithography, dry-etching, and sputter deposition steps to open and fill a contact hole is shown. The simulation result is in good agreement with the experiment, i.e. a scanning electron microscopy image of the contact hole cross section.enÄtzencontact holedepositionetchingHalbleitertechnologieKontaktlochLithographielithographyprocess simulationProzeßsimulationSchichtabscheidungsemiconductor technologyTopographiesimulationtopography simulation621670620530conference paper