Pattern-based integrative design of molded interconnect devices (MID)

Dumitrescu, RomanRomanDumitrescuGaukstern, TobiasTobiasGauksternJürgenhake, ChristophChristophJürgenhakeGausemeier, JürgenJürgenGausemeierKühn, ArnoArnoKühn2022-03-122022-03-122012https://publica.fraunhofer.de/handle/publica/3788982-s2.0-84879707097en658Pattern-based integrative design of molded interconnect devices (MID)conference paper