Large area patterning of high-density interconnects by novel UV-excimer lithography and photo patternable ORMOCERTM-dielectrica

Robertsson, M.M.RobertssonHaglund, J.J.HaglundJohansson, C.C.JohanssonGibaud, P.P.GibaudLambert, D.D.LambertPopall, M.M.PopallFröhlich, L.L.FröhlichTolvgard, A.A.TolvgardAlping, A.A.AlpingLinden, L.L.LindenRodekirch, J.J.RodekirchZemel, M.I.M.I.ZemelNunes, C.C.C.C.Nunes2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/337461en666Large area patterning of high-density interconnects by novel UV-excimer lithography and photo patternable ORMOCERTM-dielectricaconference paper