Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping

Manessis, D.D.ManessisPatzelt, R.R.PatzeltOstmann, A.A.OstmannAschenbrenner, R.R.AschenbrennerReichl, H.H.Reichl2022-03-032022-03-032004https://publica.fraunhofer.de/handle/publica/20557110.1016/S0026-2714(03)00361-5en621Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumpingjournal article