Knechtel, R.R.KnechtelKnaup, M.M.KnaupBagdahn, J.J.BagdahnWiemer, M.M.Wiemer2022-03-102022-03-102005https://publica.fraunhofer.de/handle/publica/348103In this paper a non-destructive test structure for monitoring the strength of anodic bonded glass silicon wafer compounds is introduced. The realisation of the structure, the calculation of the surface energy using FEM and practical results are shown.enanodic bondingreliabilityMEMS531620conference paper