Under CopyrightBach, LinhLinhBachYu, ZechunZechunYu2022-03-1422.1.20202019https://publica.fraunhofer.de/handle/publica/40630910.24406/publica-fhg-406309enceramic embetting670620530Ceramic Embedding Technologies for High Temperature Power ElectronicsCeramic Embedding as Packaging Solution for Future Power Electronic Applicationspresentation