Ansorge, F.F.AnsorgeBecker, K.-F.K.-F.BeckerBraun, T.T.BraunJung, E.E.JungMisawa, D.D.Misawa2022-03-092022-03-092001https://publica.fraunhofer.de/handle/publica/339042en621Plastic encapsulation technologies - Processes and characterizationconference paper