Ourinson, DanielDanielOurinsonEmanuel, GernotGernotEmanuelCsordás, A.A.CsordásDammaß, GunnarGunnarDammaßMüller, H.H.MüllerSternkiker, ChristophChristophSternkikerClement, FlorianFlorianClementGlunz, Stefan W.Stefan W.Glunz2022-03-062022-03-062019https://publica.fraunhofer.de/handle/publica/25894210.1002/pssr.201900270Herein, an inline IR thermography system as an innovative application for real‐time contactless temperature measurement of wafers-both metallized and nonmetallized-during the firing process is successfully realized in an industrial firing furnace as proof of concept and example for a thermography system in a conveyor furnace. As observed by the new system, thermocouples (TCs) seem to measure lower temperature on wafers-especially in combination with TC frames-than wafers exhibit at standard firing conditions (here up to DT ≈ 40 K). Furthermore, highly resolved spatial temperature distribution can be successfully measured on the wafer.enPhotovoltaikSilicium-PhotovoltaikMetallisierung und Strukturierungfiringmeasurementthermographyassurancebelt furnace530journal article