Soares, F.M.F.M.SoaresJaniak, K.K.JaniakKreissl, J.J.KreisslMoehrle, M.M.MoehrleGrote, N.N.Grote2022-03-122022-03-122013https://publica.fraunhofer.de/handle/publica/38136210.1117/12.2017431In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being undertaken to implement complex InP based application-specific photonic integrated circuits (ASPIC) with transmit and receive functionalities from a set of basic building blocks. The integration platform pursued at Fraunhofer HHI is building on semi-insulating substrate. Recently a variety of receiver-type PIC with up to 40 GHz bandwidth capability designed by external users was fabricated in multi-project wafer runs. Examples are demonstrated. Extension of this platform to include transmit functionalities is underway using an MOVPE based butt-coupling approach.enconference paper