Fine-Pitch 3D Stacking Technologies for High-performance Heterogeneous Integration and Chiplet-based Architectures

Ramm, PeterPeterRammBadaroglu, MustafaMustafaBadarogluFranzon, PaulPaulFranzonGarrou, PhilPhilGarrouVivet, PascalPascalVivet2022-03-062022-03-062021https://publica.fraunhofer.de/handle/publica/266334en3D integration3DICFine-Pitch 3D Stackingheterogeneous integrationchiplet621Fine-Pitch 3D Stacking Technologies for High-performance Heterogeneous Integration and Chiplet-based Architecturesbook article