Ramm, P.P.Ramm2022-03-082022-03-081999https://publica.fraunhofer.de/handle/publica/304295NOVELTY - Via holes are produced extending down through all layers of the different substrates. The top substrate is thinned from the rear side as far as the holes, followed by joining a fully processed bottom substrate to the top. Via holes are extended as far as the metallized level of the bottom substrate, producing the contact between the top and bottom substrates. DETAILED DESCRIPTION - An INDEPENDENT CLAIM for a vertical integrated circuit structure is also included. USE - The method is used for providing the electrical connections between the different substrate layers of a vertical integrated circuit structure. ADVANTAGE - The method provides a maximum density of the vertical contacts between the top substrate and the bottom substrate. DESCRIPTION OF DRAWING(S) - The figure shows a schematic representation of a stage in the manufacturing process for wiring in a substrate stack.de608621patent1998-19813239