Möbius, A.A.MöbiusElbick, D.D.ElbickWeidlich, E.-R.E.-R.WeidlichFeldmann, K.K.FeldmannSchüßler, F.F.SchüßlerBorris, J.J.BorrisThomas, M.M.ThomasZänker, A.A.ZänkerKlages, C.-P.C.-P.Klages2022-03-112022-03-112009https://publica.fraunhofer.de/handle/publica/36197910.1016/j.electacta.2008.08.050A new potentially cost-efficient technology combining patterned atmospheric pressure dielectric barrier discharge (DBD) treatment, here referred to as "plasnia-printing". and galvanic plating for the production of flexible printed circuits(FPC) is presented in this contribution. The technology is being jointly developed by partners from industry and academia, a major aim being the realization of the processes in a reel-to-reel production system. So far, plasma-printing experiments have been carried out using lab-scale batch plants. Using suitable plasma conditions and electroless plating baths. RFID-like tag and interdigital structures with line widths and spaces down to 100 mu m could already be produced. Adhesion of copper on DBD treated polyinticle foil reached up to about 1 N/mm, as was determined in a peel test similar to that described in the DIN 53494.enFlexible Printed Circuitplasma printingdielectric barrier dischargepatterned metallizationplastic metallization667541conference paper